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Cover of Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments by Cepeda-Rizo, Juan

Kalaignar Centenary Library, Madurai · reference copy, to be read in the library

Where to find it: Sixth floor, call number 621.381 CEP.

Book details

Author
Cepeda-Rizo, Juan
Publisher
CRC Press
Year
2022
ISBN
9781032160818

Copies in the library (1)

FloorCall numberBarcodeStatus
Sixth floor621.381 CEP150172Reference only (read in the library)

Next to this on the shelf

Sixth floor, in call number order.

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