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Cover of 3d Microelectronic Packaging, From Fundamentals to Applications

3d Microelectronic Packaging, From Fundamentals to Applications by Li, Yan

Kalaignar Centenary Library, Madurai · reference copy, to be read in the library

Where to find it: Sixth floor, call number 621.381 LI.

Book details

Author
Li, Yan
Publisher
Springer
Year
2017
ISBN
9783319830865

Copies in the library (1)

FloorCall numberBarcodeStatus
Sixth floor621.381 LI161417Reference only (read in the library)

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Sixth floor, in call number order.

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