
3d Microelectronic Packaging, From Fundamentals to Applications by Li, Yan
Kalaignar Centenary Library, Madurai · reference copy, to be read in the library
Where to find it: Sixth floor, call number 621.381 LI.
Book details
- Author
- Li, Yan
- Publisher
- Springer
- Year
- 2017
- ISBN
- 9783319830865
Copies in the library (1)
| Floor | Call number | Barcode | Status |
|---|---|---|---|
| Sixth floor | 621.381 LI | 161417 | Reference only (read in the library) |
Next to this on the shelf
- Advances In Semiconductor Nanostructures Growth Characterization Properties And Applications (Pb 2017) 621.381 LAT
- Electrical Engineers Reference Book 16E (2003) 621.381 LAU
- Handbook Of Sensors And Transducers 621.381 LAW
- Handbook Of Sensors And Transducers 621.381 LAW
- 3d Microelectronic Packaging, From Fundamentals to Applications (this book)
- Micromechanical Systems And Devices Microsensors (Hb 2016) 621.381 LI
- Principles Of Plasma Discharges And Materials Processing, Second Edition 621.381 LIE
- Mechanics of Microelectromechanical Systems 621.381 LOB
- Dielectric Resonator Antennas 621.381 LUK